116-04A / B-187極導(dǎo)熱環(huán)氧灌封料

說(shuō)明：116-04A是一種氮化物填充的雙組分環(huán)氧灌封和封裝化合物。產(chǎn)品是

設(shè)計(jì)用于在固化過(guò)程中迅速釋放滯留空氣，從而形成光滑、無(wú)針孔的表面。使用B-187時(shí)

希望使用壽命長(zhǎng)，耐熱性高。116-04A是F940A更導(dǎo)熱的版本。

A部分B部分-187混合物

外觀：灰琥珀灰

粘度（cps）：3600 500 3100

配合比（按重量計(jì)）：100 3----

適用期：---->4小時(shí)

混合說(shuō)明：在加入固化劑之前，在原容器中預(yù)混料A部分。將B部分添加到A部分

攪拌均勻。當(dāng)需要高溫性能時(shí)，與零件B-187一起使用。注：不是

B-187的結(jié)晶不常見(jiàn)。在水浴中加熱至40-45°C，使材料返回

原始粘度。催化劑的結(jié)晶不會(huì)以任何方式影響產(chǎn)品的性能。到

防止再結(jié)晶，將B-187儲(chǔ)存在35-45°C之間。

固化說(shuō)明：

處理性能：80°C時(shí)30分鐘

*固化：80°C下1小時(shí)或

100°C時(shí)30分鐘

典型固化特性：

比重1.63

硬度（肖氏硬度d）>85

科夫。熱膨脹（in/in/℃x 10-6

）22個(gè)

熱量。條件。（帶MK）2.63

固化收縮率（%）0.189

熱變形溫度（攝氏度）115

抗拉強(qiáng)度（psi）9600

吸水率（%）<0.22

介電強(qiáng)度（伏特/密耳）475

體積電阻率（Ω-cm）1 x 1015

功率因數(shù)（60赫茲）0.028

介電常數(shù)（60赫茲）4.3

儲(chǔ)存：保質(zhì)期：在20-25°C的原始密封容器中保存12個(gè)月。

116-04A / B-187極導(dǎo)熱環(huán)氧灌封料

116-04A / B-187
EXTREMELY THERMALLY CONDUCTIVE, EPOXY POTTING COMPOUND
DESCRIPTION: 116-04A is a nitride filled, two component, epoxy potting and encapsulating compound. Product is
designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. Use B-187 when
long pot life and higher heat resistance is desired. 116-04A is a more thermally conductive version of F940A.

Part A Part B-187 Mixture
Appearance: Grey Amber Grey
Viscosity (cps): 3600 500 3100
Mix Ratio (By Weight): 100 3 ----
 Pot Life: ---- ---- > 4 Hrs
MIXING INSTRUCTIONS: Premix Part A in original container prior to adding curing agent. Add Part B to Part A
and mix until uniform. Use with Part B-187 when high temperature performance is desired. NOTE: It is not
unusual for crystallization of the B-187 to occur. Warm to 40-45°C in a water bath to return the material to it's
original viscosity. The crystallization of the catalyst does not affect the performance of the product in any way. To
prevent re-crystallization, store the B-187 at temperatures between 35-45°C.
CURING INSTRUCTIONS:

Handling Properties: 30 min @ 80°C
Full Cure: 1 hr @ 80°C or
30 min @ 100°C
TYPICAL CURED PROPERTIES:
Specific Gravity 1.63
Hardness (Shore D) > 85
Coef. of Thermal Exp. (in/in/°C x 10-6
) 22
Therm. Cond. (W/mK) 2.63
Cure Shrinkage (%) 0.189
Heat Distortion Temp. (°C) 115
Tensile Strength (psi) 9600
Water Absorption (%) < 0.22
Dielectric Strength (volts/mil) 475
Volume Resistivity (Ω-cm) 1 x 1015
Power Factor (60 HZ) 0.028
Dielectric Constant (60 HZ) 4.3
STORAGE: Shelf Life: 12 months at 20-25°C in original sealed containers.