Helios 5 Laser PFIB System
- 公司名稱 賽默飛世爾科技（中國）有限公司
- 品牌 FEI/賽默飛
- 型號
- 產(chǎn)地
- 廠商性質(zhì) 生產(chǎn)廠家
- 更新時間 2025/1/20 16:33:49
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欲了解更多信息，請瀏覽公司網(wǎng)站：www.thermofisher.com 賽默飛世爾科技中國簡介賽默飛世爾科技進入中國發(fā)展已超過35年，在中國的總部設(shè)于上海，并在北京、廣州、香港、成都、沈陽、西安、南京、武漢、昆明等地設(shè)立了分公司，員工人數(shù)約為5000名。我們的產(chǎn)品主要包括分析儀器、實驗室設(shè)備、試劑、耗材和軟件等，提供實驗室綜合解決方案，為各行各業(yè)的客戶服務(wù)。為了滿足中國市場的需求，現(xiàn)有7家工廠分別在上海、北京、蘇州和廣州等地運營。我們在全國還設(shè)立了8個應(yīng)用開發(fā)中心以及示范實驗室，將世界級的前沿技術(shù)和產(chǎn)品帶給中國客戶，并提供應(yīng)用開發(fā)與培訓(xùn)等多項服務(wù)；擁位于上海的中國創(chuàng)新中心，擁有有100多位專業(yè)研究人員和工程師及70多項專利。創(chuàng)新中心專注于針對垂直市場的產(chǎn)品研究和開發(fā)，結(jié)合中國市場的需求和國外先進技術(shù)，研發(fā)適合中國的技術(shù)和產(chǎn)品；我們擁有遍布全國的維修服務(wù)網(wǎng)點和特別成立的中國技術(shù)培訓(xùn)團隊，在全國有超過2600名專業(yè)人員直接為客戶提供服務(wù)。我們致力于幫助客戶使世界更健康、更清潔、更安全。
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科學(xué)儀器
Helios 5 Laser PFIB System
FIB SEM laser tool for high throughput millimeter scale cross sectioning and 3D characterization with nanometer resolution
The Thermo Scientific Helios 5 Laser PFIB System combines the best-in-class monochromated Elstar Scanning Electron Microscopy (SEM) Column with a plasma focused ion beam (PFIB) and a femtosecond laser to produce a high-resolution imaging and analysis tool with in-situ ablation capability, offering unprecedented material removal rates for fast millimeter-scale characterization at nanometer resolution.
Key Features
Fast material removal
Millimeter-scale cross sections with up to 15,000x faster material removal than a typical gallium focused ion beam.
Accurate and repeatable cut placement
The same coincident point for all 3 beams (SEM/PFIB/laser) enables accurate and repeatable cut placement and 3D characterization.
High throughput processing of challenging materials
Includes non-conductive or ion-beam-sensitive samples.
Shares all capabilities of the Helios 5 PFIB platform
High-quality gallium-free TEM and APT sample preparation and high-resolution imaging capabilities.
Statistically relevant subsurface and 3D data analysis
Acquire data for much larger volumes within a shorter amount of time.
Fast characterization of deep subsurface features
Extraction of subsurface TEM lamella or chunks for 3D analysis.
Fast and easy characterization of air-sensitive samples
No need to transfer samples between different instruments for imaging and cross-sectioning.
Specifications
| Femtosecond-laser specifications | ||
|---|---|---|
| Laser integration |
| |
| Laser Output | ||
| First Harmonic |
| 1030 nm (IR) |
| <280 fs | |
| Second Harmonic |
| 515 nm (green) |
| <300 fs | |
| Optics | ||
| Coincident point |
| |
| Objective lens |
| |
| Polarization |
| |
| Repetition rate |
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| Position accuracy |
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| Protective shutter |
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| Software |
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| Safety |
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